NEW
JEDEC STANDARDS
JEDEC publishes several new and updated standards:
This first publication developed by JEDEC's newest main committee, JC-70 Wide Bandgap Power Electronic Conversion Semiconductors, JEP173 is available for free download from the JEDEC website.
JEDEC publishes several new and updated standards
- JESD22-B110B.01: Mechanical Shock - Device and Subassembly
- JESD230D: NAND Flash Interface Interoperability
- JESD8-21C: POD135 - 1.35 V Pseudo Open Drain I/O
- JESD8-30A: POD125 - 1.25 V Pseudo Open Drain I/O
- JESD8-33: 0.5 V Low Voltage Swing Terminated Logic (LVSTL05)
This first publication developed by JEDEC's newest main committee, JC-70 Wide Bandgap Power Electronic Conversion Semiconductors, JEP173 is available for free download from the JEDEC website.
JEDEC publishes several new and updated standards
- JEP118A: Guidelines for GaAs MMIC PHEMT/MESFET and HBT Reliability Accelerated Life Testing
- J-STD-075A: Classification of Non-IC Electronic Components for Assembly Processes
- JS-002-2018: ANSI/ESDA/JEDEC Joint Standard for Electrostatic Discharge Sensitivity Testing - Charged Device Model (CDM) - Device Level
- JESD250B: Graphics Double Data Rate 6 (GDDR6) SGRAM Standard
- JEP143D: Solid State Reliability Assessment Qualification Methodologies
- JESD84-B51A: Embedded Multi-Media Card (e•MMC), Electrical Standard (5.1)
- JEP132A: Process Characterization Guideline
- JESD22-B112B: Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature
- JESD22-B113B: Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products
- JESD216C: Serial Flash Discoverable Parameters (SFDP)
- JEP001-1A: Foundry Process Qualification Guidelines - Backend of Life
- JEP001-2A: Foundry Process Qualification Guidelines - Front End Transistor Level
- JEP001-3A: Foundry Process Qualification Guidelines - Product Level
- JESD47K: Stress-Test-Driven Qualification of Integrated Circuits