PARTNERS - CONTRACT SMT AND HYBRID ASSEMBLY
MADE IN THE U.S.A.
ADVANCED CIRCUIT TECHNOLOGYAdvance Circuit Technology, Inc. (ACT) is a contract electronic manufacturing company located in Rochester, New York. From prototype to production, we offer turnkey solutions for electronic design & manufacturing. See more information below after the "quote information request form"
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SMT & BOX ASSEMBLY MINI BROCHURE
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CHIP AND WIRE HYBRID MINI-BROCHURE
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CAGE/NCAGE # 4RSH2
NAICS Codes 334418 - Printed Circuit Board Assembly (Electronic Assembly) Manufacturing 334413 - Thick Film Hybrid Manufacturing 334415 - Electronic Resistor Manufacturing UNSPSC Codes 232100 252017 Standards IPC-J-STD IPC-A-610 |
Advance Circuit Technology, Inc., (ACT) a contract electronic manufacturing company located in Rochester, New York, offers electronic PCB assembly, thick-film hybrid circuit design and manufacturing, final electronic assembly, and testing.
Specifically, ACT provides solutions to your complex electronic design and manufacturing problems. We have extensive experience with advanced electronic assemblies and are actively pursuing new customers who can take advantage of our capabilities. ACT can design, prototype, and deliver hybrids in as little as two weeks and we offer prototype through production services on all electronic assemblies. Furthermore, our facility has the capacity to increase its current production level, allowing us to service new customers while satisfying the growing needs of our current customers. Many of our personnel have over 15 years of industry experience and longevity with the firm. Our production, sales, and management team provide professional customer service and support as well as engineering services to those clients who need them. From prototype to production, ACT offers turnkey solutions and an uncompromising policy that customer satisfaction is our number one priority. |
CapabilitiesDesign through Final Production
Circuit Board Assembly & Testing
Assembly: Surface Mount as small as 01005 and Thru-hole Testing: Functional, Bed of Nails, Thermal Shock and Cycling, Altitude Chamber Technologies
Organic Substrates: FR4, Aluminum Clad, Polyimide Ceramic Substrates: Al2O3, AlN, BEO Processes for Conductors and Resistor Networks
Laser Trim Resistors and Capacitors Die Attach Wire-Bond (Thermosonic and Ultrasonic) Encapsulating Parylene Coating
Circuit Board Assembly & Testing